8 Layer PCB, Gold Plated PCB,Rogers PCB Manufacturer in China

PCB Capability

Process	Item	Process	Instruction
Basic Capablity	Layer Count	0-16L	Max 16L for mass production,Max 16L for prototype. Over 16L, please send mail inquiry.
	SurfaceTreatmen	Carbon,HAL,HAL LF,ENIG,Peelable Mask,Immersion Tin/Silver,OSP,Hard Gold,Selective Gold,Electrolytic Gold	Supply various finish quoting,not noly HAL,HAL LF,ENIG,Peelable Mask,Immersion Silver,Carbon in quoting system.Please send mail inquiry if the the finish isn't display in quoting system.
	Blind & Buried Via	Multi-press Cycle≤ 3 times	Please send mail inquiry
	Finished Board Thicknes	0.2--6.0mm	Typical board thickness:0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/2.8/3.0/3.2mm, even 6.0mm for mass production.Please send mail inquiry if it exceeds that.
	Tolerance For Finished Board Thickness (BoardThickness≥1.0mm)	± 10%	For example,the requred board thickness is 1.6mm,the actual thickness range 1.44(1.6-1.6×10%)mm to1.76(1.6+1.6×10%)mm .
	Tolerance For Finished Board Thickness (BoardThickness＜1.0mm)	±0.1mm	For example,the requred board thickness is 0.8mm,the actual thickness range 0.7mm(0.8-0.1) to 0.9mm(0.8+0.1).
	Material Type	FR-4,HF Base Material,Alu Base,Cu Base,,Halogen-Free,Rogers.	Except for FR-4 and Alu Base in quoting system,Please send mail inquiry.
Image Transfer & Etching	Min Track Width/Space	≥3/3mil(0.076mm)	4/4mil (1OZ finish copper) ,6/6mil(2OZ finish copper),10/10mil(3OZ finish copper)
	Min Copper Gridding Width/Gap	≥6mil/8mil(0.15/0.20mm)	6/8mil (1OZ finish copper) ,8/10mil(2OZ finish copper),10/12mil(3OZ finish copper)
	Min Each Text Font Width	≥8mil(0.20mm)	8mil (1OZ finish copper) , 10mil(2OZ finish copper), 12mil(3OZ finish copper)
	Min BGA	≥8mil(0.2mm)	Please send mail inquiry
	Finish Outer Copper Thickness	1-12oz	＞3OZ，Please send mail inquiry
	Finish Inner Copper Thickness	0.5-12oz	＞3OZ，Please send mail inquiry
	Min Spacing from board edge to Conductiv	≥10mil(0.25mm)	Spacing≥0.25mm for Routing,＞0.35mm for scoring. Otherwise accept copper exposed on board edge.
	Min Width of the Trace Connected Copper Ground	4mil
Drilling	Max Aspect Ratiofor,Board thickness vs drill bit size	<12	＞8,please send mail inquiry
	Min Half Plated Hole	0.5mm
	Min hole size for mechanical drill	0.2mm	Recommend hole size ≥0.3mm,PTH size tolerance +/-3mil
	Min Slot Size	0.6mm	Slot Size Tolerance +/-0.1mm
	Min space between holes	0.2mm	Space between holes(in different network) ≥0.25mm
	Standard Stamp Hole Size	0.5mm	Typical distance between stamp holes edge is 0.25mm,Placed in the center of outline, stamp holes count at each side ≥ 3
	Max Solder Filled Via	≤0.6mm	Just cover the vias(＞0.6mm),can't be filled.
	Min Annular Ring for Via	4mil	Min 6mil annular ring for component hole.Increase Annular rings help electricity flows.
Solder Mask	Solder Mask Colour	Green,White,Gloss/Matt Black,Blue,Yellow,Red and Other Special Colour.	Supply various soldermask colour,please contact customer service for inquiry.
	Min Solder Bridge	Green Ink, 0.1mm	Require over 0.2mm space between copper pads to keep solder bridge.Thicker copper thickness, larger space required.
	Min Solder Bridge	Other Ink, 0.12mm
Silkscreen	Min Text Height	≥28mil	If the text height ＜ 0.8mm,the silkscreen can't be clear.
Silkscreen	Min Text Font Width	≥5mil	If the text font width ＜ 0.1mm,the silkscreen can't be printed.
Profiling	Max board size	610mm x 1200mm	Board length＞800mm,please send mail inquiry.
Panelisation	Different Boards In a Panel	max. 10 different PCBs	Scoring or Rout with breakout pins. Beyond 6types, please send mail inquiry.
Technology	Peel Srength	≥2.0N/cm
	Flame Retardant Rating	94V-0
	Impedance Controled Type	Single ended, Differential,Single ended Coplanar.Differential Coplanar	Control 45~85 OHM For Single ended/Single ended Coplanar Impedance,Control 85~110 OHM For Differential/Differential Coplanar Impedance
	Special Process	Resin Filled,via in pad,Mixed Lamilnate,Blind & Buried Via,IC Bonding ,Thick Copper.	Special processes need to be reviewed.