Product name:
Single sided aluminum substrate board

Characteristic：
Pure aluminum substrate, heat dissipation performance is good; Toyo white ink, after high temperature baking does not produce discoloration; applied to the high thermal performance requirements of the environment.

Specifications：
Layer count: 1
Board thickness: 1.0mm
Base materials: aluminium base
Finished size: 180*120mm
Surface finish: OSP
Line width/line space: 12/12mil
Minimum hole: NA
Solder resist color: white
Cu thickness: 2 OZ

Product name:
Copper substrate board

Characteristic：
1, copper substrate, good thermal performance, stable mechanical properties; used in high requirements on the heat dissipation environment;
2, the appearance of copper drilling, machining difficulty;
3, compared with the ordinary copper substrate is different, the board needs to be made of copper plating metal hole.

Specifications：
Layer count: 1
Board thickness: 2.0mm
Base materials: Copper substrate board
Finished size: 97*56mm
Surface finish: Immersion
Line width/line space: 10/10mil
Minimum hole: 1.2mm
Solder resist color: Sensitive green
Cu thickness: 2 OZ